China's BOE has raised four billion yuan (US$585.53 million) in funding for its 8G LCD panel fab project in Beijing, according to a cnstock.com report.

The BOE project to build China's first 8G fab broke ground in the third quarter of 2009 and is expected to ramp up production in the third quarter of 2011, said the report.

BOE currently has a 5G line in Beijing with a monthly capacity of 100,000 substrates, a 4.5G line in Chengdu with a monthly capacity of 30,000 substrates, and a 6G Line in Hefei with a monthly capacity of 90,000 substrates, the report added.